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Dynamics of Liquid Solidification
Title statement Dynamics of Liquid Solidification [electronic resource] : Thermal Resistance of Contact Layer / by Zygmunt Lipnicki. Publication Cham : Springer International Publishing : Imprint: Springer, 2017. Phys.des. XII, 137 p. 88 illus., 17 illus. in color. online resource. ISBN 9783319534329 Edition Mathematical Engineering, ISSN 2192-4732 Contents Introduction -- Solidification -- Solidification of PCM Materials -- The Model of Solidification of A Liquid with the Contact Layer -- Solidification on a Rectangular Geometrics -- Solidification in an Annular Space -- Solidification of a Liquid Flowing into the Channel -- The Role of the Contact Layer in a Solidification Process -- Phase Heat Accumulator. Notes to Availability Přístup pouze pro oprávněné uživatele Another responsib. SpringerLink (Online service) Subj. Headings Engineering. * Computer mathematics. * Physics. * Thermodynamics. * Heat engineering. * Heat transfer. * Mass transfer. * Fluid mechanics. Form, Genre elektronické knihy electronic books Country Německo Language angličtina Document kind Electronic books URL Plný text pro studenty a zaměstnance UPOL 
book
This monograph comprehensively describes phenomena of heat flow during phase change as well as the dynamics of liquid solidification, i.e. the development of a solidified layer. The book provides the reader with basic knowledge for practical designs, as well as with equations which describe processes of energy transformation. The target audience primarily comprises researchers and experts in the field of heat flow, but the book may also be beneficial for both practicing engineers and graduate students.
Introduction -- Solidification -- Solidification of PCM Materials -- The Model of Solidification of A Liquid with the Contact Layer -- Solidification on a Rectangular Geometrics -- Solidification in an Annular Space -- Solidification of a Liquid Flowing into the Channel -- The Role of the Contact Layer in a Solidification Process -- Phase Heat Accumulator.
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