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Modeling self-heating effects in nanoscale devices
Title statement Modeling self-heating effects in nanoscale devices / K. Raleva, A.R. Shaik, D. Vasileska, S.M. Goodnick. [elektronický zdroj] Publication San Rafael [California] (40 Oak Drive, San Rafael, CA, 94903, USA) : Morgan & Claypool Publishers, [2017] Distribution Bristol [England] (Temple Circus, Temple Way, Bristol BS1 6HG, UK) : IOP Publishing, [2017] Phys.des. 1 online resource (various pagings) : illustrations (some color). ISBN 9781681741239 (online) 9781681742519 mobi Edition [IOP release 3] IOP concise physics, ISSN 2053-2571 Note "Version: 20170801"--Title page verso. "A Morgan & Claypool publication as part of IOP Concise Physics"--Title page verso. Internal Bibliographies/Indexes Note Includes bibliographical references. Contents Preface -- 1. Introduction -- 1.1. Some general aspects of heat conduction -- 1.2. Solution of the self-heating problem -- 1.3. Modeling heating effects in state of the art devices with the commercial tool SILVACO Content note 2. Current state of the art in modeling heating effects in nanoscale devices -- 2.1. Some general considerations about the solution of the heat transport problem in devices -- 2.2. Solving lattice heating problem in nanoscale devices -- 2.3. Multi-scale modeling--modeling of circuits (CS and CD configuration) -- 2.4. Conclusions. 3. Phonon Monte Carlo simulation -- 3.1. Phonon-phonon scattering -- 3.2. Monte Carlo simulation procedure -- 3.3. Verification of Monte Carlo code -- 3.4. Phonon Monte Carlo results -- 3.5. Conclusions. 4. Summary -- 4.1. The choice of proper thermal boundary conditions -- 4.2. Thermal conductivity model currently used in the simulator -- 4.3. Multiscale modeling of device + interconnects -- 4.4. Phonon Monte Carlo need and its necessary improvements -- Appendix A. Derivation of energy balance equations for acoustic and optical phonons. Notes to Availability Přístup pouze pro oprávněné uživatele Audience Researchers in semiconductor physics and materials, nanoscience and engineering, solid state electronics. Note Způsob přístupu: World Wide Web.. Požadavky na systém: Adobe Acrobat Reader, EPUB reader. or Kindle reader. Another responsib. Shaik, Abdul Rawoof, Vasileska, Dragica, Goodnick, Stephen M. (Stephen Marshall), 1955- Another responsib. Morgan & Claypool Publishers, Institute of Physics (Great Britain), Subj. Headings Nanoelectromechanical systems - Thermal properties. * Heat - Transmission. * Electronic devices & materials. * TECHNOLOGY & ENGINEERING / Electrical. Form, Genre elektronické knihy electronic books Country Kalifornie Language angličtina Document kind Electronic books URL Plný text pro studenty a zaměstnance UPOL 
book
Accurate thermal modeling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modeling methods that must be employed in order to determine a device's temperature profile.
Preface -- 1. Introduction -- 1.1. Some general aspects of heat conduction -- 1.2. Solution of the self-heating problem -- 1.3. Modeling heating effects in state of the art devices with the commercial tool SILVACO2. Current state of the art in modeling heating effects in nanoscale devices -- 2.1. Some general considerations about the solution of the heat transport problem in devices -- 2.2. Solving lattice heating problem in nanoscale devices -- 2.3. Multi-scale modeling--modeling of circuits (CS and CD configuration) -- 2.4. Conclusions3. Phonon Monte Carlo simulation -- 3.1. Phonon-phonon scattering -- 3.2. Monte Carlo simulation procedure -- 3.3. Verification of Monte Carlo code -- 3.4. Phonon Monte Carlo results -- 3.5. Conclusions4. Summary -- 4.1. The choice of proper thermal boundary conditions -- 4.2. Thermal conductivity model currently used in the simulator -- 4.3. Multiscale modeling of device + interconnects -- 4.4. Phonon Monte Carlo need and its necessary improvements -- Appendix A. Derivation of energy balance equations for acoustic and optical phonons.
Number of the records: 1