Vytisknout
1. 3D Microelectronic Packaging
3D Microelectronic Packaging [electronic resource] : From Fundamentals to Applications / edited by Yan Li, Deepak Goyal.. Springer eBooks. Cham : Springer International Publishing : Imprint: Springer, 2017.. IX, 463 p. 331 illus., 253 illus. in color.
Plný text pro studenty a zaměstnance UPOL