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Surface treatment of materials for adhesion bonding

  1. Údaje o názvuSurface treatment of materials for adhesion bonding / Sina Ebnesajjad, Cyrus F. Ebnesajjad
    Osobní jméno Ebnesajjad, Sina (autor)
    Údaje o vydáníSecond edition
    NakladatelKidlington ; Waltham, Mass. : William Andrew, 2014
    Fyz.popis1 online zdroj
    ISBN9780323265041 (online)
    0323265049 (online)
    PoznámkaTitle from title screen.
    Poznámky o skryté bibliografii a rejstřícíchObsahuje bibliografické odkazy a rejstřík
    Úplný obsahFront Cover; Surface Treatment of Materials for Adhesive Bonding; Copyright Page; Contents; Preface; Preface to First Edition; Acknowledgments; I. Background and Theory; 1 Introduction to Surface Preparation; 1.1 Definition of Surface Preparation, Adhesives, and Adhesive Bonding; 1.2 Introduction to Surface Treatment; 1.2.1 Degreasing; 1.2.2 Abrasion; 1.2.3 Chemical Treatment; References; 2 Surface Tension and Its Measurement; 2.1 Introduction; 2.2 What is an Interface?; 2.3 Surface Tension; 2.4 Surface Free Energy; 2.4.1 Surface Energy of Solids; 2.4.2 Work of Adhesion.
    Poznámka o obsahu2.5 Contact Angle (Young's Equation)2.6 Laplace's Equation; 2.7 Effect of Temperature on Surface Tension; 2.8 Surface Tension Measurement; 2.8.1 Measurement for Liquids: Du Nouy Ring and Wilhelmy Plate Methods; 2.8.2 Measurement for Solids: Liquid Homolog Series; References; 3 Surface Energy of Solids and Its Measurement; 3.1 Introduction; 3.2 Determining the Surface Energy of Solids; 3.2.1 Fractional Polarity; 3.3 Equation of State; 3.4 Surface Tension Components; 3.5 Polymer Melt Method; 3.6 Critical Surface Tension; 3.7 Other Methods for Estimation of Surface Tension of Molten Polymer.. 3.7.1 Grunberg and Nissan's Relationship3.7.2 Hildebrand and Scott's Equation; 3.7.3 McGowan's Equation; 3.8 Shuttleworth's Equation; References; 4 Surface and Material Characterization Techniques; 4.1 Introduction; 4.2 Surface Analysis Techniques; 4.3 Optical (Light) Microscopy; 4.4 Infrared Spectroscopy; 4.5 Raman Spectroscopy; 4.6 Scanning Electron Microscopy (SEM); 4.7 Rutherford Backscattering Theory (RBS); 4.8 Energy Dispersive X-Ray Spectroscopy (EDS); 4.9 Transmission Electron Microscopy (TEM); 4.10 Electron Spectroscopy for Chemical Analysis (ESCA).. 4.11 Auger Electron Spectroscopy (AES)4.12 Ion Scattering Spectroscopy (ISS); 4.13 Secondary Ion Mass Spectroscopy (SIMS); 4.14 Time-of-Flight Secondary Ion Mass Spectroscopy (ToF-SIMS); 4.15 Mass Spectroscopy or Spectrometry (MS); 4.16 Atomic Force Microscopy (AFM); 4.17 Electron Energy Loss Spectroscopy (EELS); 4.18 Gas Chromatography (GC); 4.19 Nuclear Magnetic Resonance (NMR); 4.20 Differential Scanning Calorimetry (DSC); 4.21 Differential Thermal Analysis (DTA); 4.22 Dynamic Mechanical Analysis (DMA); 4.23 Thermogravimetric Analysis (TGA); 4.24 Adhesive Bond Testing; 4.24.1 Tensile.. 4.24.2 Shear4.24.3 Peel; References; 5 Theories of Adhesion; 5.1 Introduction; 5.2 Mechanical Theory; 5.3 Electrostatic (Electronic) Theory; 5.4 Diffusion Theory; 5.5 Wetting Theory; 5.6 Chemical Bonding; 5.6.1 Acid-Base Theory of Adhesion; 5.7 Weak Boundary Layer Theory; 5.8 Definition of Failure Modes; 5.9 Mechanisms of Bond Failure; References; II. Surface Treatment Methods and Techniques; 6 Material Surface Preparation Techniques; 6.1 Introduction; 6.2 General Considerations; 6.3 Surface Treatment of Metals; 6.4 Cleaning (Degreasing) Metals; 6.4.1 General Sequence of Cleaning.
    Poznámky k dostupnostiPřístup pouze pro oprávněné uživatele
    PoznámkyZpůsob přístupu: World Wide Web
    DefektyeBooks on EBSCOhost
    Dal.odpovědnost Ebnesajjad, Cyrus F. (autor)
    Tištěná verze knihy Ebnesajjad, Sina.  Surface treatment of materials for adhesion bonding
    Předmět.hesla fyzika povrchů pevných látek surfaces (physics) * adheze adhesion
    Forma, žánr elektronické knihy electronic books
    Konspekt539 - Fyzikální stavba hmoty. Jaderná fyzika. Molekulární fyzika
    MDT 539.211 , 539.61 , (0.034.2:08)
    Země vyd.Velká Británie ; Spojené státy americké
    Jazyk dok.angličtina
    Druh dok.Elektronické zdroje
    URLhttp://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=610815
    kniha

    kniha


    Aimed at engineers and materials scientists in a wide range of sectors, this book is a unique source of surface preparation principles and techniques for plastics, thermosets, elastomers, ceramics and metals bonding. With emphasis on the practical, it draws together the technical principles of surface science and surface treatments technologies to enable practitioners to improve existing surface preparation processes to improve adhesion and, as a result, enhance product life. This book describes and illustrates the surface preparations and operations that must be applied to a surface.

    Front Cover; Surface Treatment of Materials for Adhesive Bonding; Copyright Page; Contents; Preface; Preface to First Edition; Acknowledgments; I. Background and Theory; 1 Introduction to Surface Preparation; 1.1 Definition of Surface Preparation, Adhesives, and Adhesive Bonding; 1.2 Introduction to Surface Treatment; 1.2.1 Degreasing; 1.2.2 Abrasion; 1.2.3 Chemical Treatment; References; 2 Surface Tension and Its Measurement; 2.1 Introduction; 2.2 What is an Interface?; 2.3 Surface Tension; 2.4 Surface Free Energy; 2.4.1 Surface Energy of Solids; 2.4.2 Work of Adhesion.2.5 Contact Angle (Young's Equation)2.6 Laplace's Equation; 2.7 Effect of Temperature on Surface Tension; 2.8 Surface Tension Measurement; 2.8.1 Measurement for Liquids: Du Nouy Ring and Wilhelmy Plate Methods; 2.8.2 Measurement for Solids: Liquid Homolog Series; References; 3 Surface Energy of Solids and Its Measurement; 3.1 Introduction; 3.2 Determining the Surface Energy of Solids; 3.2.1 Fractional Polarity; 3.3 Equation of State; 3.4 Surface Tension Components; 3.5 Polymer Melt Method; 3.6 Critical Surface Tension; 3.7 Other Methods for Estimation of Surface Tension of Molten Polymer.3.7.1 Grunberg and Nissan's Relationship3.7.2 Hildebrand and Scott's Equation; 3.7.3 McGowan's Equation; 3.8 Shuttleworth's Equation; References; 4 Surface and Material Characterization Techniques; 4.1 Introduction; 4.2 Surface Analysis Techniques; 4.3 Optical (Light) Microscopy; 4.4 Infrared Spectroscopy; 4.5 Raman Spectroscopy; 4.6 Scanning Electron Microscopy (SEM); 4.7 Rutherford Backscattering Theory (RBS); 4.8 Energy Dispersive X-Ray Spectroscopy (EDS); 4.9 Transmission Electron Microscopy (TEM); 4.10 Electron Spectroscopy for Chemical Analysis (ESCA).4.11 Auger Electron Spectroscopy (AES)4.12 Ion Scattering Spectroscopy (ISS); 4.13 Secondary Ion Mass Spectroscopy (SIMS); 4.14 Time-of-Flight Secondary Ion Mass Spectroscopy (ToF-SIMS); 4.15 Mass Spectroscopy or Spectrometry (MS); 4.16 Atomic Force Microscopy (AFM); 4.17 Electron Energy Loss Spectroscopy (EELS); 4.18 Gas Chromatography (GC); 4.19 Nuclear Magnetic Resonance (NMR); 4.20 Differential Scanning Calorimetry (DSC); 4.21 Differential Thermal Analysis (DTA); 4.22 Dynamic Mechanical Analysis (DMA); 4.23 Thermogravimetric Analysis (TGA); 4.24 Adhesive Bond Testing; 4.24.1 Tensile.4.24.2 Shear4.24.3 Peel; References; 5 Theories of Adhesion; 5.1 Introduction; 5.2 Mechanical Theory; 5.3 Electrostatic (Electronic) Theory; 5.4 Diffusion Theory; 5.5 Wetting Theory; 5.6 Chemical Bonding; 5.6.1 Acid-Base Theory of Adhesion; 5.7 Weak Boundary Layer Theory; 5.8 Definition of Failure Modes; 5.9 Mechanisms of Bond Failure; References; II. Surface Treatment Methods and Techniques; 6 Material Surface Preparation Techniques; 6.1 Introduction; 6.2 General Considerations; 6.3 Surface Treatment of Metals; 6.4 Cleaning (Degreasing) Metals; 6.4.1 General Sequence of Cleaning.

Počet záznamů: 1  

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